LCP-Sumitomo Sumikasuper E6008
To maintain stable dielectric properties and strict coplanarity during lead-free surface mount (SMT) reflow soldering up to 300°C, Sumitomo's Sumikasuper E6008 delivers through its 40% glass fiber reinforced Liquid Crystal Polymer (LCP) matrix. Boasting a density of 1.62 g/cm³ and a heat deflection temperature of 279°C, this high-heat, high-strength grade offers an outstanding ASTM flexural modulus of 12,300 MPa and exceptional low-loss dielectric performance (0.005 dissipation factor at 1GHz). Jucheng Precision, under IATF 16949 and ISO 13485 medical frameworks, specializes in micro-molding Sumikasuper E6008. Utilizing five-axis CNC-machined S136 stainless steel tooling, we control its anisotropic shrinkage, delivering flash-free micro-bobbins verified by Zeiss CMM.
Sumikasuper E6008 Mechanical Rigidity & Dielectric Profile
SUMIKASUPER™ LCP E6008 is a 40% glass fiber reinforced thermotropic liquid crystalline polyester engineered by Sumitomo Chemical, designed to deliver exceptional high heat resistance, rigid strength, and stable low dielectric loss:
| Physical & Electrical Parameter | SUMIKASUPER E6008 Spec Values | High-Frequency Electrical Advantage |
|---|---|---|
| Structural Rigidity | Flex Modulus 12.3 GPa / Strength 147 MPa | Provides metal-like structural stiffness, preventing component distortion during dynamic automated multi-pin coil windings. |
| Dielectric Performance | DK 3.2 / Dissipation Factor 0.005 (at 1GHz) | Delivers outstandingly low dielectric tangent, ensuring clean, high-speed signal transmissions in 5G bobbins and relays. |
| SMT Solder Resistance | 300 °C Solder Bath Resistance (60s) | Resists blistering or mechanical structural softening under peak lead-free surface mount technology (SMT) reflow thermal profiles. |
Structural Component Process Configurations for Sumikasuper E6008
With its high-flow melt performance and low mold shrinkage, Sumikasuper E6008 processes consistently inside precision cavities:
| Component Category | Molding Process Focus |
|---|---|
| Precision Micro-Bobbins & Relays | Excellent. The primary process for Sumikasuper E6008. Designed for high-speed micro-injection molding of delicate telecommunication relays and fine-coiled bobbins. |
| Fine-Pitch SMT Connectors | Excellent. Low linear thermal expansion and standard easy-release characteristics allow automatic, high-efficiency ejection of multi-cavity microelectronics. |
| High-Heat Printer & Automotive Accessories | Good. Outstanding dimensional stability, low outgassing, and excellent high-temperature creep resistance prevent structural distortion in dynamic fuser bearings. |
LCP-Sumitomo Sumikasuper E6008 High-Frequency Dielectric & Micro-Flash Matrix
Molding an ultra-high heat resistant, 40% glass-fiber reinforced LCP like Sumikasuper E6008 requires precise gating, extreme thermal limits, and advanced venting to prevent outgassing:
Micron-Level Flash Control (Tooling Precision)
Because Sumikasuper E6008 exhibits extreme flowability (low viscosity) during peak standard molding at 360°C, molten resin can seep easily into minor mold gaps, causing parting line flash. Jucheng’s tooling division uses 5-axis CNC machines to achieve micro-tolerances, keeping mold parting clearances strictly within 0.005mm on premium S136 stainless steel mold cavity blocks.
Managing High Fiber Abrasive Wear
40% short glass fibers act as an abrasive medium under high injection speeds. Jucheng’s tooling division prevents cavity erosion by constructing molds with premium hardened tool steel (H13) heat-treated to 50–52 HRC and mirror-polished, ensuring long-term parting line precision and flash-free parts.
Uniform Temperature Control Matrix
We maintain mold temperatures at 80°C–120°C (preferably 110°C/230°F) using pressurized oil temperature controllers. High mold temperatures maximize surface gloss, reduce weld lines, and prevent surface glass-fibers from floating, ensuring a smooth and non-fibrous finish.
Pre-Drying & Outgassing Venting
We dry raw resin in desiccant hopper dryers at 130°C (266°F) for 5 hours. This eliminates surface splay and prevents weld-line micro-voids, keeping internal moisture strictly below 0.01%. Precise venting slots (0.015mm depth) are cut along parting lines to exhaust gas during high-melt runs.
Key Application Fields for LCP-Sumitomo Sumikasuper E6008
- High-Density Telecommunication & 5G Hardware: High-frequency board-to-board (B2B) connectors, USB Type-C sockets, SIM card slots, CPU sockets, camera module frames, and microelectronics.
- Automotive Powertrains & Sensors (IATF 16949): Ignition coil housings, transmission sensors, powertrain control modules, LED lamp sockets, and electric water pump sensors.
- Medical Diagnostics & Instruments (ISO 13485 Compliant): High-end medical connectors, diagnostic cartridge bobbins, clinical tubing adapters, and surgical tools.
Properties
| Density | 1.62 g/cm³ |
| Tensile Strength (ASTM D638) | 147 MPa |
| Tensile Elongation (ASTM D638 | 5.2 % |
| Flexural Strength (ASTM D790) | 143 MPa |
| Flexural Modulus (ASTM D790) | 12.3 GPa |
| Izod Notched Impact Strength (ASTM D256) | 108 J/m |
| Melting Temperature (DSC) | 340 - 360 °C |
| Heat Deflection Temperature (HDT @ 1.82 MPa) | 279 °C |
| Solder Resistance (60s) | 300 °C |
| Dielectric Constant (1GHz) | 3.2 - |
| Dielectric Dissipation Factor (1GHz) | 0.005 - |
| Linear Mold Shrinkage (Flow Direction) | 0.02 - 0.05 % |
| Linear Mold Shrinkage (Cross Direction) | 0.35 % |
| Flammability Rating (0.15mm) | UL 94 V-0 Class |
| Maximum Part Size | 600 x 400 mm |
| Minimum Part Size (Micro Molding limit) | 0.1 x 0.1 mm |