LCP-Toray Siveras LX70G35
Maintaining uncompromised coplanarity and ultra-low outgassing under SMT reflow temperatures up to 255°C requires an exceptionally tough, high-precision polymer, which Toray’s Siveras LX70G35 delivers through its 35% glass fiber reinforced Liquid Crystal Polymer (LCP) matrix. Boasting a density of 1.66 g/cm³ and a heat deflection temperature of 255°C, this high-heat, high-toughness grade offers a massive ASTM flexural modulus of 16,000 MPa and excellent vibration damping properties. Jucheng Precision, under ISO 9001 and IATF 16949 certified frameworks, specializes in micro-molding Siveras LX70G35. Using 5-axis CNC-machined S136 tool cavities and 35+ advanced presses, we control its anisotropic shrinkage to deliver flash-free, thin-walled micro-components verified by Zeiss CMM.
Siveras LX70G35 High-Toughness & Low-Outgassing Profile
SIVERAS® LX70G35 is a tough, low-outgassing liquid crystal polyester (LCP) resin engineered by Toray, designed to deliver exceptional mechanical strength, stiffness, and vibration absorption properties:
| Physical & Structural Property | Siveras LX70G35 Tested Spec | Molding & Electronics Advantage |
|---|---|---|
| Structural Rigidity | Flex Modulus 16,000 MPa / Strength 175 MPa | Delivers metal-like stiffness and high flexural strength, preventing part deformation during dynamic automated multi-pin windings. |
| Extremely Low Outgassing | Patented Ultra-Low Volatiles Package | Minimizes volatile gas outgassing during high-temp runs, preventing metal-contact corrosion in microelectronic relays. |
| Subzero Unnotched Impact | Tough & High Vibration Absorption | Maintains exceptional mechanical toughness and vibration absorption under dynamic high load, preventing structural fatigue. |
Structural Component Process Configurations for Siveras LX70G35
With its ultra-low melt viscosity and high self-reinforcing crystallinity, Siveras LX70G35 processes consistently inside precision cavities:
| Processing Method | Molding Compatibility & Operational Details |
|---|---|
| High-Density Board-to-Board Sockets | Excellent. The primary process for Siveras LX70G35. Optimized for multi-cavity, ultra-thin-walled connector grids with wall thicknesses down to 0.15mm. |
| Precision SMT Micro-Coils | Excellent. High toughness and low outgassing prevent dynamic structural warping, making it ideal for micro-helical coil bobbins and relays. |
| Low-Gas Industrial Housings | Good. High specific modulus, low outgassing, and excellent high-temperature creep resistance prevent structural distortion in camera module carriers. |
LCP-Toray Siveras LX70G35 Fast-Crystallization Guide
Molding an ultra-high heat resistant, 35% glass-fiber reinforced LCP like Siveras LX70G35 requires precise gating, extreme thermal limits, and advanced venting to prevent outgassing:
Micron-Level Flash Control (Tooling Precision)
Because Siveras LX70G35 exhibits extreme flowability (low viscosity) and rapid crystallization speed during peak standard molding at 360°C, molten resin can seep easily into minor mold gaps, causing parting line flash. Jucheng’s tooling division uses 5-axis CNC machines to achieve micro-tolerances, keeping mold parting clearances strictly within 0.005mm on premium S136 stainless steel mold cavity blocks.
Anisotropic Shrinkage & Warpage Control
Siveras LX70G35 shrinks much less along the flow (0.05%) than perpendicular to it (0.55%). We use Moldflow simulation during our free DFM review to balance gate locations, aligning glass fibers uniformly to prevent component warping and out-of-tolerance dimensions.
Mold Temperature Control (Surface Quality)
We maintain mold temperatures at 80°C–120°C using pressurized oil temperature controllers. High mold temperatures maximize surface gloss, reduce weld lines, and prevent surface glass-fibers from floating, ensuring a smooth and non-fibrous finish.
Pre-Drying & Outgassing Venting
We dry raw resin in desiccant hopper dryers at 130°C (266°F) for 5 hours. This eliminates surface splay and prevents weld-line micro-voids, keeping internal moisture strictly below 0.01%. Precise venting slots (0.015mm depth) are cut along parting lines to exhaust gas during high-melt runs.
Key Application Fields for LCP-Toray Siveras LX70G35
- High-Density Telecommunication & 5G Hardware: Fine-pitch board-to-board (B2B) connectors, USB Type-C sockets, SIM card slots, CPU sockets, camera module frames, and microelectronics.
- Automotive Powertrains & Sensors (IATF 16949): Ignition coil housings, transmission sensors, powertrain control modules, LED lamp sockets, and electric water pump sensors.
- Medical Instruments (ISO 13485 Compliant): Minimally invasive surgical tips, high-end medical connectors, diagnostic cartridge bobbins, and catheter components requiring SMT soldering.
Properties
| Density | 1.66 g/cm³ |
| Tensile Strength (ASTM D638) | 175 MPa |
| Tensile Elongation at Break (ASTM D638) | 3 % |
| Flexural Strength (ASTM D790) | 220 MPa |
| Flexural Modulus (ASTM D790) | 16,000 MPa |
| Izod Notched Impact Strength (ASTM D256) | 90 J/m |
| Melting Temperature | 320 - 340 °C |
| Heat Deflection Temperature (HDT @ 1.82 MPa) | 255 °C |
| Linear Thermal Expansion (Flow) | 1.0E-5 - 1.5E-5 cm/cm/°C |
| Linear Mold Shrinkage (Flow Direction) | 0.05 % |
| Linear Mold Shrinkage (Cross Direction) | 0.55 % |
| Flammability Rating (0.15mm) | UL 94 V-0 Class |
| Maximum Part Size | 600 x 400 mm |
| Minimum Part Size (Micro Molding limit) | 0.1 x 0.1 mm |