LCP-Celanese Vectra E130i
Resistere alle temperature di rifusione senza piombo fino a 280°C mantenendo una planarità strutturale sub-millimetrica fino a 0,1 mm di spessore richiede un polimero auto-rinforzante specializzato, che il Vectra E130i di Celanese offre attraverso la sua matrice di Polimero a Cristalli Liquidi (LCP) rinforzato con fibra di vetro al 30%. Con una densità di 1,62 g/cm³ e un punto di fusione di 340°C, questo grado ad alto flusso fornisce un eccezionale modulo a trazione di 15.000 MPa insieme a un'eccezionale stabilità dimensionale a basso ritiro. Jucheng Precision, nell'ambito dei sistemi ISO 9001 e IATF 16949, è specializzata nel micro-stampaggio del Vectra E130i per assemblaggi di connettori e telecomunicazioni 5G ad alta densità. Utilizzando i nostri stampi in H13 lavorati con CNC a 5 assi, controlliamo il suo ritiro anisotropo e ottimizziamo la resistenza delle linee di saldatura, fornendo componenti senza difetti verificati tramite CMM Zeiss.
Vectra E130i Structural Mechanics & Anisotropic Shrinkage Profile
Celanese™ Vectra® E130i is a 30% glass fiber reinforced Liquid Crystal Polymer (LCP) resin, certified to deliver unmatched mechanical stiffness, ultra-thin flowability, and low-warpage properties under ISO/ASTM standards:
| Parametro strutturale/fisico | Vectra E130i Tested Spec | 5G & Connector Advantage |
|---|---|---|
| Modulo a trazione | 15.0 GPa (15,000 MPa) (ISO 527-1,2) | Provides extraordinary, metal-like structural stiffness, preventing part deflection during dynamic multi-pin automated terminal insertions. |
| Flow Shrinkage | Nearly Zero (0.02% to 0.05% parallel) | Highly oriented polymer chains align along the flow direction, eliminating linear thermal shrinkage and ensuring precise dimensional stability. |
| Distorsione al Calore (HDT) | 275 °C (DAM @ 1.80 MPa) | Maintains unbending mechanical stiffness under high-heat SMT lead-free reflow (melting point 340°C), preventing pin alignment drift. |
Ultra-Thin Wall Process Adaptability for Vectra E130i
With its ultra-low melt viscosity and high self-reinforcing crystallinity, Vectra E130i processes predictably inside sub-millimeter cavities:
| Categoria del componente | Focus sul processo di stampaggio |
|---|---|
| Fine-Pitch Board-to-Board (B2B) Connectors | Excellent. The primary process for Vectra E130i. Optimized for multi-cavity, ultra-thin-walled connector grids with wall thicknesses down to 0.1mm. |
| High-Speed SMT Assemblies | Excellent. Resists blistering during high-temperature surface mount technology (SMT) reflow, ensuring flawless flat surfaces. |
| Advanced Camera Module Carriers | Good. Outstanding dimensional stability, low outgassing, and excellent flow properties prevent structural warping in delicate smartphone lenses. |
LCP-Celanese Vectra E130i Tooling & Knit-Line Management Blueprint
Molding an ultra-high flow, semi-crystalline polymer like Vectra E130i requires strict weld-line optimization and anisotropic shrinkage compensation:
Compensating for Anisotropic Shrinkage
Vectra E130i exhibits almost zero shrinkage in the flow direction (0.02%–0.05%) but significantly higher shrinkage perpendicular to the flow (0.35%). Our in-house tooling division uses 5-axis CNC machines to cut precise mold cavities and balance cooling paths, preventing uneven thermal contraction and part warping.
Optimizing Weak Weld Lines (Knit Lines)
LCP molecules align heavily along the flow direction. This orientation causes weld lines (where two flow fronts meet) to be mechanically weak. Jucheng’s tooling engineers conduct detailed Moldflow simulations during our free 24-hour DFM phase to position gates strategically, shifting weld lines away from high-stress zones.
S136 Mirror-Polished Tooling (Purity Preservation)
Due to the extreme clamping pressures and melt velocities of LCP E130i, Jucheng’s tooling division uses hardened, corrosion-resistant S136 stainless steel molds. We heat-treat cavities to 52 HRC and design generous draft angles (minimum 1.5° to 2.0°) to ensure clean part release.
Protocollo Esteso di Pre-Essiccazione con Essiccante
While LCP absorbs minimal water, moisture causes hydrolytic splay and weld line degradation. We desiccant-dry Vectra E130i resin at 150°C (302°F) for 4 hours, keeping internal moisture below 0.01% to secure optimal molecular bonds.
Key Application Fields for LCP-Celanese Vectra E130i
- 5G Telecommunications & High-Density Electronics: Fine-pitch board-to-board connectors, USB Type-C plugs, SIM card slots, CPU sockets, camera module frames, and high-frequency RF connectors.
- Gruppi propulsori e sensori per automotive (IATF 16949): Ignition coil bobbins, transmission sensors, powertrain control modules, LED lamp sockets, and electric water pump sensors.
- Strumenti medici (conformi ISO 13485): Punte chirurgiche minimamente invasive, connettori medici di alta gamma, bobine per cartucce diagnostiche e componenti per cateteri che richiedono saldatura SMT.
Proprietà
| Densità | 1.62 g/cm³ |
| Modulo a trazione | 15.000 MPa |
| Resistenza a trazione a rottura | 190 MPa |
| Allungamento a rottura in trazione | 1.9 % |
| Resistenza a flessione | 240 MPa |
| Modulo a flessione | 14.000 MPa |
| Resistenza all'urto Charpy con intaglio (23°C) | 11 kJ/m² |
| Resistenza all'urto con intaglio Izod (23°C) | 110 J/m |
| Temperatura di fusione | 340 °C |
| Temperatura di distorsione al calore (HDT @ 1.80 MPa) | 275 °C |
| Ritiro di Stampaggio Lineare (Direzione di Flusso) | 0.02 - 0.05 % |
| Ritiro di Stampaggio Lineare (Direzione Trasversale) | 0.35 % |
| Dielectric Strength (1.5mm) | 35 kV/mm |
| Resistività di volume | 1.0E+16 Ohm-cm |
| Dimensione massima del pezzo | 600 x 400 mm |
| Dimensione Minima del Pezzo (Limite di Micro Stampaggio) | 0,1 x 0,1 mm |