LCP-Celanese Vectra E840i
Die Herstellung dreidimensionaler spritzgegossener Schaltungsträger (3D-MID) mit integrierten Schaltungen auf Polymerträgern erfordert eine hohe thermische Lötbeständigkeit und selektive Metallisierbarkeit, die Celanese Vectra E840i LDS durch seine mit 40 % Mineralien gefüllte, laserdirektstrukturierende Flüssigkristallpolymer-Matrix (LCP) bietet. Mit einer Dichte von 1,81 g/cm³ und einem Schmelzpunkt von 335 °C enthält diese Spezialsorte aktive Metallkatalysatoren, die für die anschließende chemische Metallisierung (Kupfer, Nickel, Gold) optimiert sind, während eine extrem geringe Verformung beibehalten wird. Jucheng Precision, das unter strengen ISO-9001- und IATF-16949-Standards arbeitet, ist auf hochpräzises Spritzgießen von Vectra E840i spezialisiert. Gestützt durch über 35 moderne Pressen und hauseigene 5-Achs-CNC-Werkzeuge kontrollieren wir seine anisotropen Schrumpfvariablen (0,1 %-0,5 %) und liefern makellose Mikrosubstrate, die durch Zeiss-KMM verifiziert werden.
Vectra E840i LDS Plating & Mechanical Profile
VECTRA® E840i LDS is a 40% mineral filled, laser-direct-structuring Liquid Crystal Polymer (LCP) resin engineered by Celanese, designed to deliver stable plating performance, low warpage, and excellent heat resistance:
| Physikalische und optische Eigenschaft | Vectra E840i Spec Values | 3D-MID Molding Advantage |
|---|---|---|
| LDS Plating Catalyst | Metal-Organic Palladium Complex | Contains specialized organometallic additives, enabling high-precision laser activation and selective copper-nickel-gold plating. |
| High Stiffness Modulus | Tensile Modulus 10,000 MPa / Flexural 11,000 MPa | Delivers outstanding mechanical rigidity, ensuring complete dimensional integrity in high-density electronic assemblies. |
| Low Isotropic Warpage | 40% Isotropic Mineral Filler | Significantly reduces LCP anisotropic shrinkage, preventing part twisting and securing absolute coplanarity in SMT assemblies. |
Specialized 3D-MID Process Configurations for Vectra E840i
With its high mineral load and excellent thermal stability, Vectra E840i LDS is highly optimized for selective metallization:
| Spritzgusstechnologie-Klasse | Prozesskompatibilität & Betriebliche Details |
|---|---|
| Molded Interconnect Devices (3D-MID) | Excellent. The primary process for Vectra E840i. Optimized for multi-functional integrated electronic circuits, sensor mounts, and micro-substrates. |
| High-Density 5G Antennas | Excellent. Low dielectric tangent and high-heat dimensional stability are perfect for molding direct-platable high-frequency smartphone antennas. |
| Automotive Electronic Carriers | Good. High specific modulus, extremely low outgassing, and excellent chemical resistance allow clean powertrain electronic runs. |
LCP-Celanese Vectra E840i Tooling & LDS Quality Guide
Molding an ultra-high thermal resistant, 40% mineral-filled LCP like Vectra E840i LDS requires precise melt temperature controls and optimized mold venting:
Low-Warp Mold & Cooling Configuration
Because of the 40% mineral fillers, Vectra E840i LDS exhibits extremely low parallel shrinkage (0.10%) and low normal shrinkage (0.50%). Jucheng’s tooling division uses 5-axis CNC machines to cut precise mold cavities and balance cooling paths, preventing uneven thermal contraction and structural warping.
Drucköl-Formtemperatur-Matrix
To prevent surface fibers from floating and secure maximum plating adhesion, mold temperatures must be maintained continuously at 80°C–120°C (176°F to 248°F) using pressurized oil temperature controllers. Low mold temperatures prevent the crystalline phase from forming correctly, resulting in part warpage.
S136 Hardened Steel Core (Cavity Protection)
40% short mineral fillers act as an abrasive medium under high injection speeds. Jucheng’s tooling division prevents cavity erosion by constructing molds with premium S136 stainless tool steel hardened to 48–52 HRC and machined on our 5-axis CNCs, ensuring long-term parting line precision and flash-free parts.
Erweitertes Trockenmittel-Vortrocknungsprotokoll
While LCP absorbs minimal water, moisture causes hydrolytic splay and weld line degradation. We desiccant-dry Vectra E840i LDS resin at 150°C (302°F) for 4–6 hours, keeping internal moisture below 0.01% to secure optimal molecular bonds.
Key Application Fields for LCP-Celanese Vectra E840i
- 3D Molded Interconnect Devices (3D-MID): Platable high-frequency smartphone antennas, selective metallization sensor carriers, integrated microelectronic circuits, and diagnostic micro-substrates.
- Automotive Powertrains & Electronics (IATF 16949): High-voltage EV battery connectors, powertrain control modules, LED lamp sockets, and electric water pump sensors.
- Medizinische Instrumente (ISO 13485-konform): Minimalinvasive chirurgische Spitzen, hochwertige medizinische Steckverbinder, Spulenkörper für Diagnosekartuschen und Katheterkomponenten, die SMT-Löten erfordern.
Eigenschaften
| Dichte | 1.81 g/cm³ |
| Zugmodul | 10.000 MPa |
| HardnessTensile Stress at Break | 100 MPa |
| Bruchdehnung | 3 % |
| Biegefestigkeit | 120 MPa |
| Biegemodul | 11,000 MPa |
| Charpy-Kerbschlagzähigkeit (23°C) | 4 kJ/m² |
| Izod-Kerbschlagzähigkeit (23°C) | 6 kJ/m² |
| Schmelztemperatur | 335 °C |
| Wärmeformbeständigkeitstemperatur (HDT @ 1,80 MPa) | 227 °C |
| Linearer Formschwund (Fließrichtung) | 0.1 % |
| Linearer Formschwund (quer zur Fließrichtung) | 0.5 % |
| Electric Strength (2mm) | 28 kV/mm |
| Spezifischer Durchgangswiderstand | 2.0E+14 Ohm-cm |
| Maximale Bauteilgröße | 600 x 400 mm |
| Minimale Bauteilgröße (Mikrospritzguss-Grenze) | 0,1 x 0,1 mm |