LCP-Toray Siveras LX70G35
Maintaining uncompromised coplanarity and ultra-low outgassing under SMT reflow temperatures up to 255°C requires an exceptionally tough, high-precision polymer, which Toray’s Siveras LX70G35 delivers through its 35% glass fiber reinforced Liquid Crystal Polymer (LCP) matrix. Boasting a density of 1.66 g/cm³ and a heat deflection temperature of 255°C, this high-heat, high-toughness grade offers a massive ASTM flexural modulus of 16,000 MPa and excellent vibration damping properties. Jucheng Precision, under ISO 9001 and IATF 16949 certified frameworks, specializes in micro-molding Siveras LX70G35. Using 5-axis CNC-machined S136 tool cavities and 35+ advanced presses, we control its anisotropic shrinkage to deliver flash-free, thin-walled micro-components verified by Zeiss CMM.
Siveras LX70G35 High-Toughness & Low-Outgassing Profile
SIVERAS® LX70G35 is a tough, low-outgassing liquid crystal polyester (LCP) resin engineered by Toray, designed to deliver exceptional mechanical strength, stiffness, and vibration absorption properties:
| Physical & Structural Property | Siveras LX70G35 Tested Spec | Molding & Electronics Advantage |
|---|---|---|
| Độ cứng kết cấu | Flex Modulus 16,000 MPa / Strength 175 MPa | Delivers metal-like stiffness and high flexural strength, preventing part deformation during dynamic automated multi-pin windings. |
| Extremely Low Outgassing | Patented Ultra-Low Volatiles Package | Minimizes volatile gas outgassing during high-temp runs, preventing metal-contact corrosion in microelectronic relays. |
| Subzero Unnotched Impact | Tough & High Vibration Absorption | Maintains exceptional mechanical toughness and vibration absorption under dynamic high load, preventing structural fatigue. |
Structural Component Process Configurations for Siveras LX70G35
With its ultra-low melt viscosity and high self-reinforcing crystallinity, Siveras LX70G35 processes consistently inside precision cavities:
| Phương pháp xử lý | Khả năng tương thích Đúc & Chi tiết Vận hành |
|---|---|
| High-Density Board-to-Board Sockets | Excellent. The primary process for Siveras LX70G35. Optimized for multi-cavity, ultra-thin-walled connector grids with wall thicknesses down to 0.15mm. |
| Precision SMT Micro-Coils | Excellent. High toughness and low outgassing prevent dynamic structural warping, making it ideal for micro-helical coil bobbins and relays. |
| Low-Gas Industrial Housings | Good. High specific modulus, low outgassing, and excellent high-temperature creep resistance prevent structural distortion in camera module carriers. |
LCP-Toray Siveras LX70G35 Fast-Crystallization Guide
Molding an ultra-high heat resistant, 35% glass-fiber reinforced LCP like Siveras LX70G35 requires precise gating, extreme thermal limits, and advanced venting to prevent outgassing:
Micron-Level Flash Control (Tooling Precision)
Because Siveras LX70G35 exhibits extreme flowability (low viscosity) and rapid crystallization speed during peak standard molding at 360°C, molten resin can seep easily into minor mold gaps, causing parting line flash. Jucheng’s tooling division uses 5-axis CNC machines to achieve micro-tolerances, keeping mold parting clearances strictly within 0.005mm on premium S136 stainless steel mold cavity blocks.
Kiểm soát co ngót không đẳng hướng và cong vênh
Siveras LX70G35 shrinks much less along the flow (0.05%) than perpendicular to it (0.55%). We use Moldflow simulation during our free DFM review to balance gate locations, aligning glass fibers uniformly to prevent component warping and out-of-tolerance dimensions.
Mold Temperature Control (Surface Quality)
We maintain mold temperatures at 80°C–120°C using pressurized oil temperature controllers. High mold temperatures maximize surface gloss, reduce weld lines, and prevent surface glass-fibers from floating, ensuring a smooth and non-fibrous finish.
Pre-Drying & Outgassing Venting
We dry raw resin in desiccant hopper dryers at 130°C (266°F) for 5 hours. This eliminates surface splay and prevents weld-line micro-voids, keeping internal moisture strictly below 0.01%. Precise venting slots (0.015mm depth) are cut along parting lines to exhaust gas during high-melt runs.
Key Application Fields for LCP-Toray Siveras LX70G35
- High-Density Telecommunication & 5G Hardware: Fine-pitch board-to-board (B2B) connectors, USB Type-C sockets, SIM card slots, CPU sockets, camera module frames, and microelectronics.
- Automotive Powertrains & Sensors (IATF 16949): Ignition coil housings, transmission sensors, powertrain control modules, LED lamp sockets, and electric water pump sensors.
- Medical Instruments (ISO 13485 Compliant): Minimally invasive surgical tips, high-end medical connectors, diagnostic cartridge bobbins, and catheter components requiring SMT soldering.
Properties
| Mật độ | 1.66 g/cm³ |
| Tensile Strength (ASTM D638) | 175 MPa |
| Tensile Elongation at Break (ASTM D638) | 3 % |
| Flexural Strength (ASTM D790) | 220 MPa |
| Flexural Modulus (ASTM D790) | 16,000 MPa |
| Izod Notched Impact Strength (ASTM D256) | 90 J/m |
| Nhiệt độ nóng chảy | 320 - 340 °C |
| Nhiệt độ biến dạng nhiệt (HDT @ 1.82 MPa) | 255 °C |
| Linear Thermal Expansion (Flow) | 1.0E-5 - 1.5E-5 cm/cm/°C |
| Độ co rút khuôn tuyến tính (Hướng dòng chảy) | 0.05 % |
| Linear Mold Shrinkage (Cross Direction) | 0.55 % |
| Flammability Rating (0.15mm) | UL 94 V-0 Lớp |
| Kích thước chi tiết tối đa | 600 x 400 mm |
| Minimum Part Size (Micro Molding limit) | 0.1 x 0.1 mm |